As an important electronic connector, PCB is almost widely applied in all the electronics, which is considered as “the mother of the electronics”. Therefore, technological transformation and market research of the PCB industry has become the focus of many insiders. There are two obvious trends in the present electronic products: one is being light and short while the other is being high-speed and high-frequency, which drives the downstream PCB to develop into a high-density, high-concentration, encapsulating, sophisticated and multi-layer ones and contributes to a rising demand for high-layer plates and HDI. Being short in length of wiring and with low circuit impedance, high-layer plates, with the advantages of work with high frequency, stable performance, however, have more complicated functions, which is an unavoidable trend for the electronics technology to develop into a high –frequency, high-speed, multi-function, high-capacity ones. Besides, the further application of lar
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